Schematic capture or schematic entry is a step in the design cycle of electronic design automation (EDA) at which the electronic diagram, or electronic schematic of the designed electronic circuit is created by a designer. This is done interactively with the help of a schematic capture tool also known as schematic editor.
We develop and support schematic symbols and PCB footprints meeting IPC Standards. This includes PCB footprints as per the IPC-7351B and Recommendations made in IPC-2221 or IPC-2222
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer.
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics a stream of binary values is represented by a voltage waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion and loss.
Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Power dissipation is an important issue in present-day PCB design. Power dissipation will result in temperature difference and pose a thermal problem to a chip.
Power Integrity problems are increasing becoming difficult to handle nowadays in modern devices, which requires higher functionality at lowest possible power consumption. Moore's law still hold good, therefore silicon density doubles every year. Core frequency increase roughly follows density.
We have strong knowledge and experience in the conversion & migration of the design data across the various EDA tools. We provide accurate and error free translation of schematics, libraries and PCBs, including all constraints and properties.
Our PCB manufacturing capabilities include Small and Prototypes, Fast Delivery Mode and HDI (High Density Interconnect) PCB’S
We are expertise in delivering prototype printed circuit board assembly with surface-mount (SMT), through hole (THT) and mixed technology.
Most of the companies find that they are in a critical time crunch in order to finish their design tasks. As to overcome these time crunch we are offering many contract service
We support foams in different densities and different types of cut-outs inside the box. Die-cut foams are custom design-cut processed through die punching and machine cut.
