Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics a stream of binary values is represented by a voltage waveform. However, digital signals are fundamentally analogy in nature, and all signals are subject to effects such as noise, distortion and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. Signal integrity engineering is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC) through the package the printed circuit board (PCB).
Some of the main issues of concern for signal integrity are ringing, crosstalk, ground bounce, distortion, signal loss, and power supply noise.
High Speed PCB Design refers to the techniques that must be followed in order for a circuit to function properly when the edge rate of the signal is high. The failure in high speed digital circuit may or may not be readily reproducible. They are sometimes difficult to diagnose and reproduce. So care must be taken at the design stage itself.
The Noise in the Power Supply and its analysis also come into the preview of the High Speed Digital Design
The examples of the High Speed Bus design include DDR Bus, Hyper Transport Bus, DDR2 Bus, USB 2.0, SATA, PCI Express, PCI. High Speed Design Techniques must be applied to these Buses to ensure proper and reliable operation
Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature.
Power dissipation is an important issue in present-day PCB design. Power dissipation will result in temperature difference and pose a thermal problem to a chip. In addition to the issue of reliability, excess heat will also negatively affect electrical performance and safety. The working temperature of an IC should therefore be kept below the maximum allowable limit of the worst case. The ever-shrinking chip size causes the heat to concentrate within a small area and leads to high power density. Furthermore, denser transistors gathering in a monolithic chip and higher operating frequency cause a worsening of the power dissipation. Removing the heat effectively becomes the critical issue to be resolved.
Power Integrity issues are increasing and becoming difficult to handle nowadays in modern devices Moore’s law still hold good, therefore silicon density doubles every year. Core frequency increase roughly follows density. Data transfer rate is also increasing in connected IOs. Therefore, transient current requirement is getting higher at lower power supply voltages. The designers need to ensure good quality of power distribution at silicon pad. All this can be achieved through careful analysis of power-distribution system and ensuring good decoupling schemes.
Rehob retains passion on customised electronic product design services and has the experts to design and develop reliable hardware and embedded software solutions for a wide range of products used in the areas of automotive, healthcare, industrial machines and consumer products. We believe that the foundation of any reliable product starts from the hardware design. We can execute the complete product design cycle starting from the requirement analysis to the final delivery of the product. Rehob carries out the hardware testing in an organised process to verify the behaviour, performance, and reliability of a device or system against design specifications. It ensures a device or a system to be defect-free.
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